AT & S Technology

ECP®
TECHNOLOGY

With ECP® (Embedded Component Packaging), several electronic components can be embedded one above the other in a circuit board. With this, AT&S brings the printed circuit boards completely into the third dimension and can implement even more space-saving designs.

APPLICATIONS
  • Hearing Aid
  • V2X Communication
BENEFITS
  • Significant form factor reduction
  • Simplified thermal management through integration of heat dissipation components
  • Fewer electronic components on the surface
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