AT & S Product
HDI
MULTILAYER
Due to the increasing demands of the mobile phone industry for miniaturization and the performance of microelectronic systems, printed circuit boards were developed in 1997 that are more compact thanks to a multi-layer structure and can connect components with shorter and therefore faster signal paths.
APPLICATIONS
- Satellite Communications
- Commercial Launcher
- Ground Stations
- ADAS Computing
- Infotainment (Automotive)
- Camera (Automotive)
- Flight Mission Computer
- Flight Control
- Engine Control
- Pacemaker
- Prostheses
- Action Camera
- Smart Home Appliances
- Smartphone
BENEFITS
- Miniaturization
- High Data Rates
- Short lines
- Adaptable to different requirements
- Material with low halogen content can be used
3D RENDERING
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