Modules fulfill a specific electrical function within a system. The high level of integration requires end manufacturing processes. On the other hand, miniaturized modules help to reduce overall system size. Specific technologies like ECP® or mSAP and additional services in terms of design, simulation and supply chain, are key enabling factors for providing high end modules.

• V2X Communication
• Connectivity modules
• Power modules
• Computing modules

• System size reduction
• System cost reduction
• Easy integration (Plug & Play)
• Reduced time to market