AT & S Technology

mSAP
TECHNOLOGY

mSAP (modified Semi-Additive Process) stands for a process in which the copper conductor tracks are not etched from a layer applied to the circuit board, but are applied directly to the carrier material as conductor tracks. This means that significantly smaller structures can be realized, thus enabling further miniaturization of circuit boards and substrates.

APPLICATIONS
  • Hearing aids
  • M2M Communication
  • ADAS
  • Automotive Infotainment
  • Smartphone
BENEFITS
  • Space-saving conductor tracks
  • Miniaturization
  • Optimized signal transmission
  • Higher performance at reduced mainboard sizes
  • Radically thin PCBs for radically thin devices
  • More space for sensors, modules, multiple cameras or bigger batteries
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