mSAP (modified Semi-Additive Process) stands for a process in which the copper conductor tracks are not etched from a layer applied to the circuit board, but are applied directly to the carrier material as conductor tracks. This means that significantly smaller structures can be realized, thus enabling further miniaturization of circuit boards and substrates.
Space-saving conductor tracks
Optimized signal transmission
Higher performance at reduced mainboard sizes
Radically thin PCBs for radically thin devices
More space for sensors, modules, multiple cameras or bigger batteries